Standard Operating Procedures
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| MEMS Release, Use of Hydrofuoric Acid |
This SOP addresses the work performed to chemically etch the sacrificial oxide layers of MEMS dies. The die comes shipped with the devices being suspended in oxide, which must be etched away to free the mechanisms and enable device movement. The die is bathed in a series of chemical baths to remove photoresist and etch away sacrificial layers. One of these chemicals is Hydrofluoric Acid, which is lethal in small amounts and shows delayed symptoms. This SOP also addresses removal of waste chemicals, cleaning of equipment, and handling of a released die. |
| SUMMIT v5 Release |
This SOP addresses the work performed to chemically etch the sacrificial oxide layers of MEMS dies. The die comes shipped with the devices being suspended in oxide, which must be etched away to free the mechanisms and enable device movement. |
| Titrating With Hydrochloric Acid |
This is a generic SOP covering the steps needed to perform a titration safely. Laboratories can save this SOP and modify it to create their own SOP for titrations performed in their lab(s). |
| Crystal Mounting |
This SOP addresses the work performed to prepare, mount and clean crystals for x-ray diffraction. Also, this SOP addresses removal of waste chemicals and cleaning of equipment. |
| Micro-furnace Prep |
This SOP addresses the way to chemically etch platinum wires for the creation of a micro-furnace to be mounted on a goniometer head. It also addresses removal of waste chemicals and cleaning of equipment. |
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